LED Strip Light polymer thermal insulation material

INTRODUCTION
         Potting is to pour the liquid composite into the devices equipped with electronic components or circuits mechanically or manually, and solidify it into a thermosetting polymer thermal insulation material with excellent performance under normal temperature or heating conditions. It can strengthen the integrity of electronic components and improve the resistance to external impact and vibration; Improve the insulation between internal components and lines, which is conducive to the miniaturization and lightweight of components; Avoid direct exposure of components and circuits, improve the waterproof and moisture-proof performance of components and improve the stability.

        The quality of potting materials and the design of related product structure, the selection and assembly of some components are closely related to the potting materials used, but the potting process is often a factor that can not be ignored.


APPLICATION
        As one of the means of electronic product protection, potting process plays the role of moisture-proof, mildew proof and salt fog proof for electronic products, and increases the reliability of electronic products in harsh environment. It is irreplaceable by other protection processes. With the development of science and technology, potting materials are constantly improved and updated. Potting materials with higher comprehensive properties are constantly developed, and potting technology will also be used in a wider range of fields.


ADVANTAGES
        Potting adhesive is often used for bonding, sealing, potting or coating protection of electronic components, transformers or motor coils. The potting adhesive is liquid before curing, and the viscosity of the adhesive varies according to the composition, dosage and production process of the product. The use value of potting adhesive can be realized only after it is completely cured. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, temperature resistance, pressure resistance, corrosion resistance and shock resistance.