how to choose the right silicone rubber molding me...

Silicone rubber molds are widly used in architectural restoration,candlemaking,concrete casting,lifecasting,sculpture & art casting and special effects etc. and the molding method is different in different industries,mainly including compression molding,transfer molding and injection molding.Whether your project requires you to work from a simple, standard design or a specifically engineered print or design, the type of rubber molding method used can have a substantial impact on your project. #Compression molding an advanced rubber manufacturing method that is well suited for mass production of rubber parts and products. This practical method uses heat and pressure to bond rubber compounds and create a precise shape and size. The manufacturing process is relatively simple and involves a steel mold that is closed and heated, resulting in the melting of the rubber compound as it is forced into the mold cavities to form the desired shape. Once the mold is removed, any excess material is trimmed away and the result is a precise component with little seam. #Injection molding A common form of rubber molding and best suited for silicone molding. Silicone rubber is a highly stable, flexible compound that is able to resist extreme temperatures. Silicone is odorless, does not conduct electricity and is ideal for machinery that must operate under high pressure or high temperature. While silicone molding may not be the best choice for very large or thick objects, it is highly suitable for smaller parts that require flexibility and resistance to the elements. #Transfer molding another rubber molding technique that involves a four-step process. Transfer molding involves uncured rubber being forced through a mold by hydraulic pressure and then being allowed to cure. While the cycle time is actually shorter with transfer molding than compression molding, there is more waste because the transfer pad is scrap. However, transfer molding may be a better choice for rubber-to-metal bonding.