Silicone encapsulants for electronic components

The practice of encapsulating and potting electronic components is a well established process designed to protect delicate circuitry. This material can prevent electronic components from mechanical shock, thermal shock, vibration, chemical attack, humidity, extreme temperatures and wide thermal cycles. In addition to providing protection, the encapsulant can also play the role of thermal transfer and light emission.       There are a variety of materials on offer including polyurethanes, epoxies, silicones and many other polymers. It is important to fully understand the chemical and physical properties of each system.   Why do we use silicone encapsulants? Silicone polymers and elastomers have excellent properties including: 1. Wide operating temperature range. 2. Excellent electrical properties. 3. Good Flexibility. 4. Good chemical resistance. 5. Resistant to humidity and water. 6. No or low toxicity.   Through the selection of polymers and fillers it is possible to adjust viscosity and the final hardness and modulus of the cured rubber. Silicone encapsulants are very versatile and provide engineers with a wide product choice.   Systems that cure or change from a liquid to a solid cured rubber at room temperature are also referred to as RTV. Silicone encapsulants generally fall into two categories: condensation cure systems and addition cure systems. Understanding the differences between the two different silicone systems is very important.   Condensation Cure system Silicone: Condensation cure systems function with moisture present in the atmosphere and it can not be accelerated through heated (applying excessive heat whilst curing will be bad for the curing process). There are some small amounts of by-product produced. This is generally used for 1-Part sealants, coatings and 1 & 2 Part encapsulants.   Addition Cure system silicone: Addition cure systems adopt platinum catalyst to initiate the cure process and do not produce any by-products. Once catalysed, they will fully complete the cure process, even in a sealed enclosure and do not need to be kept open to the atmosphere. Heat can be used to accelerate the cure if required.   Shenzhen Hong Ye Jie technology Co. Ltd supplies high quality silicone encapsulants for electronic components in quantity. If you wanna get more useful information, then you should enter our cellphone entrance: http://m.szrl.net or our computer entrance: http://www.szrl.net. (FAX: 89948030 TEL: 086-755-89948019 086-755-89948006 EMAIL: info@szrl.net).