Difficult sunlight aging electronic potting We all know that long exposure to the sun can cause premature aging of the material exhibits here to introduce a hard sunlight aging electronic potting . Also known as electronic potting glue , is a broad term . The adhesive for electronic components , sealing , potting and coating protection. Figure - electronic potting Electronic potting belong in the uncured liquid, liquid, glue viscosity depending on the material , performance, production processes and products differ . Difficult sunlight aging characteristics of electronic potting : 1, the semi- solidified glue curing , good adhesion to many substrates and sealing performance, with very excellent anti alternating hot and cold performance. 2 , after mixing the two components is not fast gel , and thus have a longer operating time , once the heat will quickly curing, curing time can be freely controlled . 3 , the curing process without a by-product , no shrinkage . 4, with excellent electrical insulating properties and resistance to high- temperature performance (-50 ℃ ~ 200 ℃). 5 , the gel can be cracked by the force automatically heal , also play a waterproof , moisture-proof effect, does not affect the results. Difficult sunlight aging electronic potting in order to achieve full cure after its use value , after curing can play a waterproof, dustproof, insulation, thermal conductivity , confidentiality, anti-corrosion , heat , shock effect. Aging sunlight difficult part of an electronic potting electronic potting , and many types of electronic potting , are: thermal conductivity potting , epoxy encapsulants , silicone sealant , polyurethane potting plastic , LED encapsulants . Sunlight is difficult to use electronic potting aging methods and precautions : Before mixing , the first component A proper use of manual or mechanical agitation , component B should be fully shake the container in a sealed state , and then to use. • When you need to attach to the application materials, please confirm before use can be attached , and then apply . • mixed, according to the weight ratio ratio, response to changing the mixing ratio of simple experiments carried out after application . Usually the amount of component B , the more the curing time is short , the shorter the operating time. • Generally, the thickness of 10mm or less potting degassing naturally without further degassing . If large potting thickness, surface and internal pinholes or bubbles may occur , therefore, should put the mixture into the vacuum container, degassed under 700mmHg at least five minutes . • The higher the temperature , the faster the cure , the shorter the operating time. Heat curing is generally not recommended to avoid surface and internal pinholes or bubbles , affect the appearance and sealing performance. • former small molecules generated during the curing process is not fully released , potting devices do not completely closed , plus the high temperature (> 100 ℃). Completely closed if necessary , in the Guangdong region , the proposed summer 3 days , 7 days before the winter be closed . After the initial curing adhesive may take appropriate heating ( temperature does not exceed 60 ℃) ways to accelerate the curing . Ye Jie Technology Co., Ltd. welcome new and old customers and dealers to negotiate business and cooperation agency . Let us join hands to create brilliant. you can email us info@szrl.net.our welcome to visite our compamy website is http://www.szrl.net/.
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